|
||
|
Basic Member
加入日期: Aug 2003
文章: 27
|
請益~請問這句英翻中這樣翻對嗎?
Thermal Deformation Measurement and Evaluation of Printed Circuit Board by Using Holography
印刷電路板的熱量變形測量和評估由使用全息術 |
|||||||
2004-11-06, 10:07 AM
#1
|
|
