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Master Member
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引用:
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作者hawtz
那這樣就要變成
Fermi II VS. HD6000 了
HD6000 Q3~Q4就會登場了耶....... 
NV何時才有Fermi II?
真的要壓住GF100的耗電
可能要用新制程 e.g 32/28nm........ 
TSMC 取消32nm.
28nm可能還要等
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HD6000 可能還是40nm 本來預計要用32nm.........  |
或是調整架構, A3 已經是最後一個了, 接下來就是 B0?
從Ax ~ B0, 就可能有溫度上的改進.
我的8800 GTX 第一版跟RMA 回來的(不知是幾版, 沒拆風扇不知道)溫度上就有很大的差別
再從設計上動手改良, 降低熱功耗應該不難
如果NV真的向他們宣稱的花那麼多在研發上的話
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